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Lattice Diamond Version History

DiamondVersionHistory

    DiamondVersionHistory

    Diamond 3.14

    • Device Support:
      • MachXO2™ (LAMXO2)
        • Performance Hardware Data Status – Final, version 34.4.
          • 256HC (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
          • 640HC (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
      • MachXO3LF™ (LAMXO3LF)
        • Performance Hardware Data Status – Final, version 37.5.
          • 640E (-5) 1.2V (AUTO) – CSBGA132, TQFP100
          • 1300C (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
          • 1300E (-5) 1.2V (AUTO) – CSBGA132, TQFP100
          • 2100C (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
          • 2100E (-5) 1.2V (AUTO) – CSBGA132, TQFP100
          • 4300C (-5) 2.5V/3.3V (AUTO) – CSBGA132
          • 4300E (-5) 1.2V (AUTO) – CSBGA132
      • MachXO3D™ (LCMXO3D)
        • Performance Hardware Data Status – Final, version 2.2.
          • 4300HC (-5/-6) 2.5V/3.3V (COM/IND) – FTBGA256
    • Tool and Other Enhancements:
      • Diamond Installation Wizard
        • The LATTICE_LICENSE_FILE and SALT_LICENSE_SERVER environment user variables have been added to the installation page.
        • The default Flexnet variable LM_LICENSE_FILE is now displayed on the installation page.
        • Diamond installer is updated to support QuestaSim single package, which is more than 2G in size.
      • License – BSD licensing is added to embedded_source files under the \lscc\diamond\3.14\embedded_source directory.
      • Platform Designer – When using the Platform Designer tool in Diamond, the only supported operating system in Linux is RHEL 7.9.
      • Programmer – The Deployment Tool has been updated to increase the maximum SPI Flash Size to 1Gb.
      • Simulation
        • Diamond software now includes QuestaSim™ Lattice OEM Edition for simulation, debugging, and verification processes. The ModelSim simulator has been replaced by this new tool.
        • Since QuestaSim is a 64-bit application, it can support designs whose memory usage is greater than 4GB during simulation.
        • To be able to use the new QuestaSim Lattice FPGA edition on Diamond 3.14, you need to regenerate your license from the website.
      • Tool Options –The “Check Controlled Device License” option has been added to Tool Options. This prevents Diamond from checking out license features that are not included in the license file.

    Diamond 3.13

    • Device Support:
      • MachXO2™ (LAMXO2)
        • 256HC (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
        • 640HC (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
      • MachXO3LF™
        • LAMXO3LF (Auto Devices)
          • 640E (-5) 1.2V (AUTO) – CSBGA132, TQFP100
          • 1300C (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
          • 1300E (-5) 1.2V (AUTO) – CSBGA132, TQFP100
          • 2100C (-5) 2.5V/3.3V (AUTO) – CSBGA132, TQFP100
          • 2100E (-5) 1.2V (AUTO) – CSBGA132, TQFP100
          • 4300C (-5) 2.5V/3.3V (AUTO) – CSBGA132
          • 4300E (-5) 1.2V (AUTO) – CSBGA132
        • LCMXO3LF (Commercial/Industrial Devices)
          • 640E (-5/-6) 1.2V (COM/IND) – CSBGA132, TQFP100
          • 1300C (-5/-6) 2.5V/3.3V (COM/IND) – CSBGA132, TQFP100
          • 1300E (-5/-6) 1.2V (COM/IND) – CSBGA132, TQFP100
          • 2100C (-5/-6) 2.5V/3.3V (COM/IND) – CSBGA132, TQFP100
          • 2100E (-5/-6) 1.2V (COM/IND) – CSBGA132, TQFP100
          • 4300C (-5/-6) 2.5V/3.3V (COM/IND) – CSBGA132
          • 4300E (-5/-6) 1.2V (COM/IND) – CSBGA132
    • Tool and Other Enhancements:
      • Platform Designer – Global Export option has been added to support ASC devices with MachXO3D.
      • Programmer – The I2C TransFR feature is now available for the MachXO3LF device.
      • Strategies – The Low Skew Clock Net strategy option has been added to Place & Route Design for the ECP5 device.

    Diamond 3.12 SP1

    • New Device Support:
      • ECP5 Family
        • ECP5U™ 12k/25k/45k,TQFP144 Package is generally available.
    • Tool and Other Enhancements:
      • Bitstream File – A note regarding the use of Evaluation IP has been added to the bitstream file.
      • FlexLM Licensing Package – Diamond software installer provides standalone FlexLM executable zip file.

    Diamond 3.12

    • New Device Support:
      • Mach-NX™ 50K (LFMNX)
        • FBG484 is license controlled. Please contact Lattice Technical Support.
    • Updated Device Support:
      • CrossLink™Plus (LIFMDF)
        • 6000 80CKFBGA is generally available
      • MachXO3D™
        • Supports up to eight Analog Sense and Control (ASC) devices
      • MachXO2™ ZE
        • 1200 36WLCSP
        • 4000 81WLCSP
    • Tool and Other Enhancements:
      • Newly integrated Mentor® ModelSim® Lattice FPGA Edition simulator replaces Aldec Active-HDL™ Lattice Edition simulator.

    Diamond 3.11 SP3

    • MachXO3LF™ Device Support
      • MachXO3LF-1300, MachXO3LF-2100, and MachXO3LF-4300 Automotive Speed Grade devices.
    • MachXO3D™ Device Support
      • MachXO3D-4300 and MachXO3D-9400 Automotive Speed Grade devices.

    Diamond 3.11 SP2

    • MachXO3D™ Family Support
      • MachXO3D-4300 devices have bitstream capabilities enabled.
      • MachXO3D-9400 device data are changed to final status.

    Diamond 3.11 SP1

    • CrossLinkPlus Device Support
      • 6000 UMG64 IND package is generally available

    Diamond 3.11

    • MachXO3D Device Support
      • 9400 COM/IND Generally available
      • 4300 COM/IND/AUTO Generally available
    • RedHat Linux version 6.9/7.4 support
    • Synplify Pro timing driven synthesis

    Diamond 3.10.3

    Platform Manager 2 New Device Support

    • New device LPTM21L (smaller package caBGA100 equivalent of LPTM21 device)
    • LPTM21L can be used both as a master and/or slave device in conjunction with stand alone ASC devices as slave devices

    ECP5U/UM/5G Family Support

    • ECP5UM 85K caBGA381 package and SSO data are in FINAL status.
    • ECP5U 45K/25K/12K 256caBGA package is in FINAL status.
    • Automotive device timing data is in FINAL status.
    • Bit stream status is in FINAL status.

    Crosslink Family Support

    • 81csfBGA automotive package is generally available.
    • 80ckfBGA package is in FINAL status.

    New SPI Flash Support

    The following flash are supported:

    • Cypress-Spansion (S25FL064L, S25FL128L, S25FL256L, S25FL128S, SFL256S, S25FL512S, S25FS064S, S25FS128S, S25FS256S, S25FS512S).
    • GigaDevice (GD25Q20C, GD25Q40C, GD25Q80C, GD25Q16C, GD25Q64C, GD25Q127C, GD25Q256D, GD25LQ20C, GD25LQ40C, GD25LQ80C, GD25LQ16C, GD25LQ32D, GD25LQ64C, GD25LQ128D, GD25LQ256D).
    • ISSI (IS25LQ020B, IS25LQ040B, IS25LP032A, IS25LP064A, IS25LP128F, IS25LP512M, IS25WQ020, IS25W040, IS25WP040D, IS25WP080D, IS25WP016D, IS25WP032D, IS25WO064A, IS25WP28, IS25WP128F, IS25WP256D, IS25WP512M).
    • Macronix (MX25R1035F, MX25V1035F, MX25U2033E, MX25R2035F, MX25V2035F, MX25R4035F, MX25V4035F, MX25U8033F, MX25R8035F, MX25V8035F, MX25U1635F, MX25U1633F, MX25R3235F, MX25L3233F, MX25U6435F, MX25R6435F, MX25L6433F, MX25U12835F, MX25L12833F, MX25U25645G, MX25L51245G, MX25U51245G).
    • Micron (MT25QU18, MT25QU256, MT25QU512, MT25QL128, MT25QL256, MT25QL512).
    • Windbond (W25X10CL, W25X20CL, W25Q20CL, W25X40CL, W25Q40CL, W25Q80DV, W25Q16JV, W25Q16FW, W25Q32FV, W25Q32FW), W25Q32JV, W25Q32JW, W25Q64FV, W25Q64FW, W25Q64JV, W25Q64JW, W25Q128FV, W25Q128FW, W25Q128JV, W25Q256FV, W25Q256JV, W25Q256JW, W25M512JV).

    Diamond Version 3.10 SP2

    Installation of SP2 includes all the changes and features in SP1. If you have not already installed SP1, it is not necessary to do so. You can proceed by installing SP2 which is inclusive of all SP1 features.

    • ECP5U/UM/5G Family Support
      • New ECP5U 45K caBGA256 package is generally available.
        • Family LFE5U-45F-xBG256C/I (x = Grades 6,7,8).
      • ECP5U/UM/5G 85K 285csfBGA package is in FINAL status.
        • Other densities 12K/25K/45K data already in FINAL status as of SP1.
        • All devices support COM/IND/AUTO. (Except ECP5UM5G does not support AUTO.)
    • Crosslink Family Support
      • 80ckfBGA package is generally available.
      • 80ctfBGA now requires a license.
      • Timing data is in FINAL status for IND/AUTO.
      • Package and SSO data are in FINAL status for: 36WLCP, 64ucfBGA, 80ctfBGA (IND/AUTO) and 81csfBGA.
    • New SPI Flash Support
      The following flash are supported:
      • Cypress-Spansion (S25FL128L, S25FL512S, S25FL064L, S25FL256S, S25FL256L).
      • ISSI (IS25LP032D).
      • Macronix (MX25L12845G, MX25L12835F, MX66L51235F, MX25L25635F).
      • Micron (MT25QL128).
      • Windbond (W25Q128JV, W25Q128FV, W25Q32JV)
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