Silicon Has Never Been More Flexible – Add new features to your mobile design and maximize product differentiation in an instant using up to 7680 programmable logic cells.
Power for the People – Designed from the ground up for low power starting at 25 µW, these iCE40 devices maximize battery life and minimize power consumption for ultra-low power, always-on applications.
High Functional Density for the Thinnest Devices - Squeezing so much functionality in such a small BGA package was no easy task. Measuring just 1.40 mm X 1.48 mm x 0.45 mm, iCE40 LP/HX devices can fit in the most space constrained modules.
Features
- Available in three series with LUTs ranging from 384 to 7680: Low power (LP) and high performance (HX)
- Integrated hard I2C and SPI cores that enable flexible device configuration through SPI
- Match your preferred display to your application processor with interfaces such as RGB, 7:1 LVDS and MIPI DPI/DBI
- Multi-source your image sensors by implementing flexible bridges supporting common interfaces such as HiSPi, subLVDS, LVDS and Parallel LVCMOS
- Up to 128 kbits sysMEM™ Embedded Block RAM
- Industry’s broadest range of 0.35 mm - 0.40 mm pitch BGAs fit in space-constrained applications
iCE40 LM devices has been discontinued. The iCE40 LM collateral below is for reference and legacy support only. For more information, please see PCN#05-20.
